Low-pressure vacuum plasma removes organic residues and activates surfaces for stronger bonding and uniform cleaning.
High-energy plasma modifies surface chemistry for better adhesion, improved wettability, and long-lasting material performance across industries.
One source for plasma cleaners, surface treatment systems and semiconductor plasma equipment.
Plasma activation removes hidden residues and increases surface wettability, turning irregular, intermittent coating results into smooth and stable adhesion across the entire surface.
Founded in 2011, FARI PLASMA specializes in the R&D, manufacturing, and global promotion of vacuum and atmospheric plasma surface treatment equipment. Our solutions are widely used across electronics, medical, automotive, packaging, and precision manufacturing industries.
We are certified with ISO9001 and recognized as a national high-tech enterprise, ensuring consistent quality, innovation, and reliable production standards.
We innovate in plasma technology through continuous research in chamber design, RF power systems, and surface activation, creating reliable solutions for diverse industries.
Our factory uses precise machining and controlled assembly processes to produce stable, long-lasting plasma equipment with consistent performance.
Every unit undergoes strict ISO-based inspections, calibration, and aging tests to ensure accuracy, safety, and long-term reliability.
We use reinforced crates, anti-vibration protection, and moisture-resistant materials to guarantee safe delivery worldwide.
Plasma surface treatment uses ionized gas to clean, activate, or modify material surfaces, improving adhesion, wettability, and coating performance.
Our systems treat plastics, rubber, metals, ceramics, glass, composites, semiconductors, and various advanced materials.
Atmospheric plasma is used inline without a chamber for fast activation, while vacuum plasma provides deeper cleaning, finer control, and higher precision.
Common gases include oxygen, argon, hydrogen, nitrogen, and air, each providing different cleaning or activation effects.
Yes, our ICP and RIE systems are designed for precise etching, ashing, and photoresist stripping in semiconductor and microfabrication processes.
Selection depends on your material, surface requirements, throughput, and process type—our team provides customized recommendations for each project.
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